BRIGITFLEX, Inc. offers you a unique source for specialized Printed Circuits and 'concept work.'
We deliver this through innovative pre-production engineering, the latest available
specialty materials and processes, combined with decades of industry experience.
We are a Woman-Owned business (WBE), with facilities located in Elgin, IL   USA
 
We are your source for...
  • MILITARY, MEDICAL, and AEROSPACE applications.
  • Collaboration and evaluation for best manufacturability.
  • R & D 'Proof-of-Concept' projects and Reverse-engineering.
  • Surface and embedded (buried) thin-film resistors.
  • SPECIALTY MATERIALS and custom-made laminates.
  • HEAVY COPPER - both inner and outer layers.
  • EXTRA LARGE boards - flex and rigid (e.g. RF/Antenna).
  • Integrated thermal management: metal cores; heatsinks.
  • REACH and RoHS-Compliant surface finishes.
  • Ultra-thin substrates.
  • Fusion bonding.


COLLABORATIVE DEVELOPMENT PARTNERSHIPS ARE OUR MISSION

When you work with BRIGITFLEX, you will get over 30 years of hands-on experience.
Our team will work closely with you to make your concept a reality. Beyond our total in-house manufacturing capability, we have cultivated uniquely strong relationships with our suppliers and partners. This has afforded us particular strength in the construction and usage of specialty materials.

We pride ourselves on our proven ability to take a design, from the 'concept' level, and build it to meet your requirements. We achieve this by making it our business to understand your needs, and applying our manufacturing expertise to deliver successful results for you. If necessary we can help you experiment to develop new materials and manufacturing methods. We manufacture in the United States, and always strive to meet your needs in a timely manner.
Among the 'Concept' projects which BRIGITFLEX has done have included these technologies:
Metal Core Boards:


Heat sink boards:



Surface and
Embedded resistors:




Mica Boards:


No 'Out-gassing':

Specialty Materials:




...and more:

Copper, aluminum, stainless, copper-graphite, and more, with organic or inorganic insulation on either side; variety of sizes, weights, and layer counts.

We use a ceramic-filled prepreg and thermally-conductive multifuctional epoxy, engineered to provide high thermal conductivity for applications requiring thermal management. We can apply this to meet requirements in a variety of cores and heat sink boards.

thin-film resistive material: integral resistors are formed on circuit layers. Resistors can be buried within a multilayer circuit board or used on the surface. Using OhmegaPly® materials, produced for both Military and Commercial uses, including rigid (termination, RC networks, antennas, horns), and flexible (heater elements, antennas, etc.)

Combination of new and old technology has produced a new line of high-energy pulse discharge capacitors that set new standards of low equivalent series inductance and high pulse discharge.

specialty for scientific research and experimentation in high-vacuum environments, Including aerospace, both in flex and rigid (multilayers).

New materials are appearing almost daily! We will experiment to achieve the results you need with these materials. Some of the development projects we have done included pattern-plating on 3-dimensional surfaces, thicknesses down to 10 microns, multi-dielectrics, huge sizes, and very heavy copper weights.

Other technologies worked with are protected under non-disclosure agreements



PRINTED CIRCUITS

copyright © 2009 Brigitflex, Inc.